? semiconductor components industries, llc, 2012 january, 2012 ? rev. 8 1 publication order number: bsp52t1/d bsp52t1g, bsp52t3g npn small-signal darlington transistor this npn small signal darlington transistor is designed for use in switching applications, such as print hammer, relay, solenoid and lamp drivers. the device is housed in the sot-223 package, which is designed for medium power surface mount applications. features ? the sot-223 package can be soldered using wave or reflow. the formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die ? available in 12 mm tape and reel use bsp52t1 to order the 7 inch/1000 unit reel ? pnp complement is bsp62t1 ? these devices are pb ? free, halogen free/bfr free and are rohs compliant maximum ratings (t c = 25 c unless otherwise noted) rating symbol max unit collector-emitter voltage v ces 80 v collector-base voltage v cbo 90 v emitter-base voltage v ebo 5.0 v collector current i c 1.0 a total power dissipation (note 1) @ t a = 25 c derate above 25 c p d 0.8 6.4 w mw/ c total power dissipation (note 2) @ t a = 25 c derate above 25 c p d 1.25 10 w mw/ c operating and storage temperature range t j , t stg ? 65 to 150 c thermal characteristics characteristic symbol value unit thermal resistance (note 1) junction-to-ambient r ja 156 c/w thermal resistance (note 2) junction-to-ambient r ja 100 c/w maximum temperature for soldering purposes time in solder bath t l 260 10 c sec stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. device mounted on a fr-4 glass epox y printed circuit board using minimum recommended footprint. 2. device mounted on a fr-4 glass epoxy printed circuit board using 1 cm 2 pad. device package shipping ? ordering information marking diagram sot ? 223 case 318e style 1 3 2 1 collector 2,4 base 1 emitter 3 4 ayw as3 a = assembly location y = year w = work week as3 = specific device code = pb ? free package (note: microdot may be in either location) medium power npn silicon surface mount darlington transistor bsp52t1g sot ? 223 (pb ? free) 1000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. http://onsemi.com bsp52t3g sot ? 223 (pb ? free) 4000 / tape & reel
bsp52t1g, bsp52t3g http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristics symbol min typ max unit off characteristics collector-base breakdown voltage (i c = 100 a, i e = 0) v (br)cbo 90 ? ? v emitter-base breakdown voltage (i e = 10 a, i c = 0) v (br)ebo 5.0 ? ? v collector-emitter cutoff current (v ce = 80 v, v be = 0) i ces ? ? 10 a emitter-base cutoff current (v eb = 4.0 v, i c = 0) i ebo ? ? 10 a on characteristics (note 3) dc current gain (i c = 150 ma, v ce = 10 v) (i c = 500 ma, v ce = 10 v) h fe 1000 2000 ? ? ? ? ? collector-emitter saturation voltage (i c = 500 ma, i b = 0.5 ma) v ce(sat) ? ? 1.3 v base-emitter saturation voltage (i c = 500 ma, i b = 0.5 ma) v be(sat) ? ? 1.9 v switching characteristics rise time (v cc = 10 v, i c = 150 ma, i b1 = 0.15 ma) t r ? 155 ? ns delay time (v cc = 10 v, i c = 150 ma, i b1 = 0.15 ma) t d ? 205 ? ns storage time (v cc = 10 v, i c = 150 ma, i b1 = 0.15 ma, i b2 = 0.15 ma) t s ? 420 ? ns fall time (v cc = 10 v, i c = 150 ma, i b1 = 0.15 ma, i b2 = 0.15 ma) t f ? 365 ? ns 3. pulse test: pulse width 300 s, duty cycle 2.0%
bsp52t1g, bsp52t3g http://onsemi.com 3 typical characteristics (t j = 25 c unless otherwise noted) c, capacitance (pf) v r , reverse voltage (v) 0.1 1 10 1 10 100 v be(on) , base ? emitter on voltage (v) i c , collector current (ma) 0 v ce = 10 v 0.2 0.4 0.6 0.8 1.0 1.2 v be(sat) , base ? emitter saturation voltage (v) i c , collector current (ma) 0 0.01 t j = ? 55 c ic/ib = 1000 0.1 10000 0.4 0.8 1.2 1.6 2.0 2.4 t j = 25 c t j = 150 c v ce(sat) , collector ? emitter saturation voltage (v) i c , collector current (a) 0 0.01 1000000 h fe , dc current gain i c , collector current (ma) figure 1. dc current gain figure 2. collector ? emitter saturation voltage figure 3. base ? emitter saturation voltage figure 4. base ? emitter on voltage figure 5. capacitance v ce = 10 v t j = 150 c t j = ? 55 c ic/ib = 1000 10000 1000 100 0.01 0.1 1 100 10000 t j = 25 c t j = ? 55 c 0.1 1 10 0.5 1.0 1.5 2.0 3.0 3.5 t j = 25 c t j = 150 c 1 100 c ibo c obo 100000 10 1000 2.5 1000 100 10 0.01 t j = ? 55 c 0.1 10000 t j = 25 c t j = 150 c 1 1000 100 10 1.4 1.6 1.8 2.0 f t , current ? gain ? bandwidth product (mhz) i c , collector current (ma) 50 70 90 110 130 150 170 figure 6. current gain bandwidth product vs. collector current t j = 25 c 1000 100 10 190 210 230 250 v ce = 2 v
bsp52t1g, bsp52t3g http://onsemi.com 4 package dimensions sot ? 223 (to ? 261) case 318e ? 04 issue n style 1: pin 1. base 2. collector 3. emitter 4. collector a1 b1 d e b e e1 4 123 0.08 (0003) a l1 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inch. 1.5 0.059 mm inches scale 6:1 3.8 0.15 2.0 0.079 6.3 0.248 2.3 0.091 2.3 0.091 2.0 0.079 soldering footprint* h e dim a min nom max min millimeters 1.50 1.63 1.75 0.060 inches a1 0.02 0.06 0.10 0.001 b 0.60 0.75 0.89 0.024 b1 2.90 3.06 3.20 0.115 c 0.24 0.29 0.35 0.009 d 6.30 6.50 6.70 0.249 e 3.30 3.50 3.70 0.130 e 2.20 2.30 2.40 0.087 0.85 0.94 1.05 0.033 0.064 0.068 0.002 0.004 0.030 0.035 0.121 0.126 0.012 0.014 0.256 0.263 0.138 0.145 0.091 0.094 0.037 0.041 nom max l1 1.50 1.75 2.00 0.060 6.70 7.00 7.30 0.264 0.069 0.078 0.276 0.287 h e ? ? e1 0 1 0 0 1 0 l l 0.20 ??? ??? 0.008 ??? ??? *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. bsp52t1/d publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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